Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications
Defforge, Thomas, Coudron, Loic, Gautier, Gael, Grimal, Virginie, Ventura, Laurent and Tran Van, Francois
(2011)
Copper Electrochemical Deposition in Macroporous Silicon Arrays for Through Silicon Via Applications.
Institute of Electrical and Electronics Engineers (IEEE).
The present paper deals with the realization of high conductivity through silicon via from macroporous silicon arrays. The pores were first etched by anodization into a hydrofluoric acid mixture. The high aspect ratio via were then filled by an optimized potentiostatic way involving a specific electrolyte with additives. The copper micro-wires were observed by SEM whereas XRD analysis enabled the determination of copper average grain size.
| Item Type | Other |
|---|---|
| Date Deposited | 29 May 2025 09:12 |
| Last Modified | 29 May 2025 09:12 |